Operating Temperature Range:-40°C to 85°C
Power Consumption:1500W
Cooling System:Water-cooled with automatic temperature control
Max Process Chamber Pressure:1 Torr
Material Compatibility:Silicon, Germanium, III-V compounds
Process Speed:Up to 30 wafers/hour
The Applied Materials GMSV36-01-D 91/096D/E is engineered to meet the demanding requirements of modern semiconductor manufacturing. This module is designed with cutting-edge technology that ensures optimal performance across various applications, from chip fabrication to complex material processing tasks.
With its high throughput capabilities, this module significantly boosts production efficiency, allowing manufacturers to achieve higher yields and faster turnaround times. Its compatibility with a wide array of semiconductor materials ensures versatility in handling diverse components.
The module is meticulously designed for optimal performance under varying environmental conditions, making it suitable for use in a wide range of industrial settings. Whether operating in cold or warm environments, the GMSV36-01-D 91/096D/E maintains consistent performance and reliability.
Featuring an energy-efficient design, this module optimizes power usage without compromising on performance, contributing to cost-effective and sustainable operations. Its compact size facilitates easy integration into existing manufacturing lines, enhancing space utilization and workflow efficiency.
Backed by Applied Materials’ commitment to innovation and quality, the GMSV36-01-D 91/096D/E is supported by comprehensive maintenance and service options. Regular updates and expert support ensure that users can leverage the latest advancements in semiconductor manufacturing technologies, staying ahead in their competitive landscapes.
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